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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-161-8991 Item Description: Microcircuit Memory | 5962 | 011618991 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Zd6002 1 | 3 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ABKW | OVERALL HEIGHT0 345 INCHES NOMINAL |
MEMORY | ADAQ | BODY LENGTH2 030 INCHES MINIMUM AND 2 080 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH0 515 INCHES MINIMUM AND 0 600 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT0 145 INCHES MINIMUM AND 0 175 INCHES MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 5 WATTS |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0 TO 125 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0 TO 150 0 DEG CELSIUS |
MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND STATIC OPERATION AND WCLOCK AND PROGRAMMABLE AND WRESET AND MONOLITHIC |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CQWX | OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN36 INPUT |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC7 0 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZER | MEMORY DEVICE TYPERAM |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY40 PRINTED CIRCUIT |
MEMORY | ZZZK | SPECIFICATIONSTANDARD DATA18876-10246043 MANUFACTURERS SOURCE CONTROL |
ZD6315-8K | ZD6R124K | ZD6A104M | ZD6A823K |
ZD6501 1 | ZD6010 01 2 9 | ZD69APC70801 | ZD6B503M |
ZD6A224J | ZD6A104J | ZD6 8 | ZD602C124 |
ZD6010 01 2 9 | ZD6501 1 | ZD6A473J | ZD6A564K |
ZD6315-8K | ZD6A222J | ZD6R103 | ZD6315-10 |
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