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Quality guaranteed We sell only warrantied and traceable partsAt Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as 82HS641 B3A, which is a Microcircuit Memory from manufacturer Philips Semiconductors Ltd, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part 82HS641 B3A and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Philips Semiconductors Ltd parts from NSN 5962012640758, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part 82HS641 B3A purchasing process instantly, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-264-0758 Item Description: Microcircuit Memory | 5962 | 012640758 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | S | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 82hs641 B3a | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MEMORY | ADAQ | BODY LENGTH0 460 INCHES MAXIMUM |
| MEMORY | ADAT | BODY WIDTH0 460 INCHES MAXIMUM |
| MEMORY | ADAU | BODY HEIGHT0 100 INCHES MAXIMUM |
| MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 04 WATTS |
| MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
| MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
| MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
| MEMORY | CQSZ | INCLOSURE CONFIGURATIONLEADLESS FLAT PACK |
| MEMORY | CQWX | OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC |
| MEMORY | CQZP | INPUT CIRCUIT PATTERN14 INPUT |
| MEMORY | CRHL | BIT QUANTITY65536 |
| MEMORY | CSWJ | WORD QUANTITY8192 |
| MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORC-4 MIL-M-38510 |
| MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC190 00 MILLIAMPERES REVERSE CURRENT DC ABSOLUTE |
| MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
| MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0 3 VOLTS MINIMUM POWER SOURCE AND 7 0 VOLTS MAXIMUM POWER SOURCE |
| MEMORY | CZEP | CAPITANCE RATING PER CHARACTERISTIC10 00 INPUT PICOFARADS MAXIMUM AND 13 00 OUTPUT PICOFARADS MAXIMUM |
| MEMORY | CZEQ | TIME RATING PER CHACTERISTIC100 00 NANOSECONDS MAXIMUM DELAY |
| MEMORY | CZER | MEMORY DEVICE TYPEPROM |
| MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
| MEMORY | TTQY | TERMINAL TYPE AND QUANTITY28 LEADLESS |
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