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Quality guaranteed We sell only warrantied and traceable partsAt Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as UPD2167, which is a Microcircuit Memory from manufacturer Nec Electronics Usa Inc, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part UPD2167 and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Nec Electronics Usa Inc parts from NSN 5962012678169, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part UPD2167 purchasing process instantly, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-267-8169 Item Description: Microcircuit Memory | 5962 | 012678169 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Upd2167 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.065 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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