At Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as 311325-04, which is a Microcircuit Memory from manufacturer Intersil Inc, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part 311325-04 and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Intersil Inc parts from NSN 5962010512110, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part 311325-04 purchasing process instantly, submit an RFQ today.
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | CHEYENNE MISSILE MODEL 427M |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND 3-STATE OUTPUT AND W/ENABLE AND W/STORAGE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND PROGRAMMABLE AND PROGRAMMED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | PROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 11530-311325 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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