At Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as C3101, which is a Microcircuit Memory from manufacturer Intel Corporation, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part C3101 and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Intel Corporation parts from NSN 5962007620617, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part C3101 purchasing process instantly, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-762-0617 Item Description: Microcircuit Memory | 5962 | 007620617 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
C3101 | 3 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND EXPANDABLE AND HIGH SPEED AND W/DECODED OUTPUT AND W/OPEN COLLECTOR AND WIRE-OR OUTPUTS AND SCHOTTKY AND BIPOLAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+160.0 DEG CELSIUS |
CZEQ | TIME RATING PER CHACTERISTIC | 5.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 5.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
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