At Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as 170208 01, which is a Microcircuit Memory from manufacturer Ge Aviation Systems Llc, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part 170208 01 and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Ge Aviation Systems Llc parts from NSN 5962014211336, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part 170208 01 purchasing process instantly, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-421-1336 Item Description: Microcircuit Memory | 5962 | 014211336 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
170208 01 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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