At Aviation Parts Circuit, we offer an unparalleled selection of parts for the aerospace, civil aviation, defense, electronics, and IT hardware markets. Owned and operated by ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts organized into an efficient, streamlined, and easy-to-navigate purchasing platform. Part numbers such as DPZ1M16V3-20B, which is a Microcircuit Assemb from manufacturer Dpac Technologies Corp, are in stock and ready to ship with short lead times and competitive prices. We specialize in leveraging our purchasing power with major suppliers, allowing us to offer lower costs and faster shipping on all orders, even in AOG situations. Our team at Aviation Parts Circuit is available 24/7x365 to provide you with a quick quotation on part DPZ1M16V3-20B and any other NSN part listed on our website.
To help users quickly locate the parts they need, our website offers a broad scope of parametric search measures, allowing customers to filter parts by their Federal Supply Group or Class, part type, part family, CAGE Code, NSN, and more. For example, if you are in need of Dpac Technologies Corp parts from NSN 5962013947215, our website can provide you with a selection of parts exclusively from that manufacturer and NSN. At Aviation Parts Circuit, our goal is not only to improve the parts procurement process, but to revolutionize it entirely. To begin the NSN part DPZ1M16V3-20B purchasing process instantly, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-394-7215 Item Description: Microcircuit Assemb | 5962 | 013947215 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Dpz1m16v3-20b | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
CBBL | FEATURES PROVIDED | PROGRAMMABLE |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MEMORY, ELECTRICALLY ERASABLE PROGRAMMABLE ROM |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 1 MEG X 16 FLASH EEPROM MODULE |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 16 MEMORY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM ABSOLUTE INPUT AND 7.0 VOLTS MAXIMUM ABSOLUTE INPUT |
FEAT | SPECIAL FEATURES | VERSA-STACK=2STACKS OF 4STACKABLE LEADLESS CHIP CARRIERS |
TTQY | TERMINAL TYPE AND QUANTITY | 66 LEADLESS |
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