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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-343-2969 Item Description: Microcircuit Memory | 5962 | 013432969 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
28C256E 25DM 883 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ABHP | OVERALL LENGTH1 490 INCHES MAXIMUM |
MEMORY | ABKW | OVERALL HEIGHT0 432 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH0 500 INCHES MINIMUM AND 0 610 INCHES MAXIMUM |
MEMORY | CBBL | FEATURES PROVIDEDERASABLE AND WDISABLE AND MONOLITHIC |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN25 INPUT |
MEMORY | CSWJ | WORD QUANTITY32768 |
MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510 |
MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC80 00 MILLIAMPERES REVERSE CURRENT DC ABSOLUTE |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0 3 VOLTS MINIMUM POWER SOURCE AND 6 25 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC250 00 NANOSECONDS AF OUTPUT MEGAWATTS |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | ADAU | BODY HEIGHT0 172 INCHES MINIMUM AND 0 217 INCHES MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 0 WATTS |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
MEMORY | CRHL | BIT QUANTITY262144 |
MEMORY | CZEP | CAPITANCE RATING PER CHARACTERISTICERR-060 MAXIMUM AND ERR-060 MAXIMUM |
MEMORY | ADAQ | BODY LENGTH1 490 INCHES MAXIMUM |
MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CZER | MEMORY DEVICE TYPEEEPROM |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT |
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